MediaTek Announces First Chipset Based on TSMC's 3nm Process With Performance and Efficiency Enhancements: All Details

On Thursday, MediaTek announced the development of its first chipset based on Taiwan Semiconductor Manufacturing Company's (TSMC) 3nm technology. The company's flagship Dimensity chipset, which will be available next year with significant performance and efficiency gains over current-generation chipsets. The business has yet to identify which manufacturers it would collaborate with to incorporate the new CPU. Apple and Qualcomm are also rumored to be working on releasing processors with cutting-edge semiconductor technology.

In a press release, the chipmaker revealed that it has successfully manufactured its first 3nm chipset based on TSMC's advanced 3nm technology. In addition, the Taiwanese company announced that its 3nm MediaTek processors would be available in smartphones, tablets, smart automobiles, and other devices in H2 2024. According to prior rumors, Qualcomm intends to release a 3nm chipset this year, maybe at its annual Snapdragon Summit event.

The business also revealed the performance and efficiency advantages of employing TSMC's 3nm technology to produce its newest chipset. When compared to TSMC's N5 process, MediaTek claims an 18% boost in performance and speed, as well as up to a 32% reduction in power utilization at the same speed. Meanwhile, MediaTek claims that logic density has increased by 60% when compared to earlier chip technologies.

As smartphone chips get smaller in size, the technology involved in their creation becomes more sophisticated, while manufacture becomes more expensive. In December 2022, TSMC commenced manufacture of advanced 3nm devices. MediaTek's forthcoming chipset will be part of its higher-end Dimensity mobile CPUs and will most likely power flagship smartphones that will launch in the second half of 2024. 

However, MediaTek's new 3nm chipset is unlikely to be the first to power a flagship phone - Apple was the first firm to collaborate with TSMC to develop its next generation 3nm chipset, which is slated to power two of its next iPhones, the iPhone 15 Pro and the iPhone 15 Pro Max. Meanwhile, the iPhone 15 and iPhone 15 Plus are expected to include last year's top A16 Bionic technology.